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For a string voltage of 3300 V, let there be six series connected SCRs each of voltage 600V. Then the string efficiency is
Answer: c Explanation: String efficiency = 3300/(6 x 600) = 98.54
Answer: c
Explanation: String efficiency = 3300/(6 x 600) = 98.54
See lessTo have maximum possible string efficiency
Answer: b Explanation: Having similar ratings does not mean they have similar charc
Answer: b
Explanation: Having similar ratings does not mean they have similar charc
See lessSCRs are connected in parallel to fulfill the ___________ demand
Answer: b Explanation: Number of devices connected in parallel can carry huge amounts of current.
Answer: b
Explanation: Number of devices connected in parallel can carry huge amounts of current.
See lessIn the ___________ type of mounting the SCR is pressed between two heat sinks
Answer: c Explanation: In the press-pak type the device is pressed or clamped between two heat-sinks & external pressure is applied from both the sides.
Answer: c
Explanation: In the press-pak type the device is pressed or clamped between two heat-sinks & external pressure is applied from both the sides.
See lessFor low power SCRs (about 1 Ampere current) _____________ type of mounting is used
Answer: a Explanation: Lead mounting is a very simple time of mounting used for low power devices.
Answer: a
Explanation: Lead mounting is a very simple time of mounting used for low power devices.
See lessHeat dissipation from heat sink mainly takes place by
Answer: b Explanation: Heat DISSIPATION (rejection of heat to the atmosphere) takes place through convention only.
Answer: b
Explanation: Heat DISSIPATION (rejection of heat to the atmosphere) takes place through convention only.
See lessPav x (θjc + θcs + θsA) =
Answer: c Explanation: Pav = (Tj – Ta)/θjA θjA = (θjc + θcs + θsA).
Answer: c
Explanation: Pav = (Tj – Ta)/θjA θjA = (θjc + θcs + θsA).
See lessThe sink to ambient thermal resistance of SCR θsA
Answer: d Explanation: It does not depend on any of the device configurations.
Answer: d
Explanation: It does not depend on any of the device configurations.
See lessWhich of the following thermal resistance parameters depends on the size of the device and the clamping pressure?
Answer: b Explanation: The case-to-sink thermal resistance depends on the size of the device, pressure, grease between the interface, etc.
Answer: b
Explanation: The case-to-sink thermal resistance depends on the size of the device, pressure, grease between the interface, etc.
See lessThe total thermal resistance between junction and ambient θjA is 10°C/W. θjc is 2°C/W. θcs is 4°C/W. θsA = ?
Answer: a Explanation: θjA = θjc+ θcs+ θsA.
Answer: a
Explanation: θjA = θjc+ θcs+ θsA.
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